Ph.D. in Materials Engineering
Process Engineer III at Applied Materials
I am a Materials Engineer with expertise in semiconductor technology development and FEOL/BEOL integration for copper-alternative interconnects at sub-10 nm nodes. As an SRC Scholar at Rensselaer Polytechnic Institute, my research focused on mitigating electron surface scattering in highly crystalline epitaxial thin films. I will be joining Applied Materials as Process Engineer III in July 2026.
Driving the future of semiconductor scaling through advanced materials research, from atomic-scale thin film deposition to system-level interconnect integration.
Investigating electron surface scattering phenomena in directional and anisotropic conductors (PtCoO₂, PdCoO₂, CoSn, Ru) for sub-10nm interconnects. This research addresses critical resistance scaling challenges in advanced node logic devices and 3D packaging applications.
Expertise in UHV PVD, DC/RF magnetron sputtering, and ALD for epitaxial growth of Ru, AlN, Mo₂N, and topological NbAs thin films with atomic precision.
Comprehensive characterization using XRD, XRR, XPS, SEM, AFM, and electrical measurements (I-V/C-V) to establish structure-property relationships.
First-principles calculations using VASP, Quantum ESPRESSO, and Wannier90 to predict electronic structure, phonon properties, and transport phenomena.
Exploring topological semimetals like NbAs and Weyl materials for next-generation nano-scale interconnects, leveraging unique surface states for enhanced conductivity.
Administration of computational clusters for materials research, including DFT workflow automation, queue management, and mentoring researchers in high-performance computing.
Research and industry experience spanning semiconductor process engineering, materials characterization, and computational modeling.
Applied Materials, Santa Clara, CA
Joining the Etch Business Unit to develop and optimize plasma etch processes for advanced semiconductor manufacturing at 300mm wafer scale.
Applied Materials, Santa Clara, CA
Rensselaer Polytechnic Institute (RPI), Troy, NY
SUNY-Buffalo State, Buffalo, NY
Comprehensive skill set spanning materials synthesis, characterization, computational modeling, and process engineering.
Peer-reviewed publications in high-impact journals with 1,263+ citations.
Recognition for research excellence, academic achievement, and technical contributions.
Full fellowship for Ph.D. studies in Materials Engineering
2023 – 2026Albany Nanotechnology Symposium
November 2024ASM International Eastern NY Student Poster Contest
February 2024Selected for talk and poster presentation, Austin, TX
September 2025Boise State University
April 2025Open to research collaborations, industry partnerships, and academic discussions.
I'm always interested in discussing new research opportunities, semiconductor industry trends, and potential collaborations in materials science and engineering.